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Qianli Middle Layer Reballing Platform for Phone 11 X XS XSMAX Motherboard BGA ... (TYPE: 11PRO/MAX)
New
R810.00
Closed
9 Jun 24 23:02
Shipping
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Ready to ship in
The seller has indicated that they will usually have this item
ready to ship within 12 business days. Shipping time depends on your delivery address. The most
accurate delivery time will be calculated at checkout, but in
general, the following shipping times apply:
Standard Delivery
| Main centres: | 1-3 business days |
| Regional areas: | 3-4 business days |
| Remote areas: | 3-5 business days |
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Product details
Condition
New
Location
International
Bob Shop ID
615094541
SELECTED OPTION:
TYPE: 11PRO/MAX
Specification:
Model Number: Qianli BGA Reballing Fixture
Application: Computer Tool Kit
Size: 10x5x4cm
Application: Mainboard Soldering repair
Type: Repair Fixture
Application 1: for iphone xs Mainboard Soldering repair
Application 2: for iphone xsmax Mainboard Soldering repair
Application 3: for iphone x Mainboard Soldering repair
Application 4: for iphone 11 11Pro 11ProMax Mainboard Soldering repair
Package included:
1 x BGA Reballing Fixture
