YJ-QCC3003 Bluetooth 5.0 Module for Power Amplifier Board
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| Main centres: | 1-3 business days |
| Regional areas: | 3-4 business days |
| Remote areas: | 3-5 business days |
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Product details
Condition
New
Location
International
Bob Shop ID
615100772
Details:
1. The Bluetooth core uses QCC3003 chip, supports A2DP, AVRCP, HFP, AAC, I2S, etc., and uses 16M SPI FLASH memory chip. DAC adopts imported PCM5102 2. The electrolytic capacitor adopts the gold word SANYO 470UF/16V electrolytic capacitor to ensure strong and continuous power support. 3. High-precision chip resistors are selected for the resistors to ensure a good signal-to-noise ratio of the whole machine. 4. The PCB adopts 1.6mm thick double-sided board, 2.0 oz copper thickness, and the whole process of spraying tin to ensure good passing performance of large and small currents. First-class PCB quality.
Basic parameters:
PCB size: 60*59MM Voltage: DC 7-12V (inside + outside -) Bluetooth 5.0 receiving distance is about 10 meters
Package includes:
1 x?Bluetooth 5.0 Module
1. The Bluetooth core uses QCC3003 chip, supports A2DP, AVRCP, HFP, AAC, I2S, etc., and uses 16M SPI FLASH memory chip. DAC adopts imported PCM5102 2. The electrolytic capacitor adopts the gold word SANYO 470UF/16V electrolytic capacitor to ensure strong and continuous power support. 3. High-precision chip resistors are selected for the resistors to ensure a good signal-to-noise ratio of the whole machine. 4. The PCB adopts 1.6mm thick double-sided board, 2.0 oz copper thickness, and the whole process of spraying tin to ensure good passing performance of large and small currents. First-class PCB quality.
Basic parameters:
PCB size: 60*59MM Voltage: DC 7-12V (inside + outside -) Bluetooth 5.0 receiving distance is about 10 meters
Package includes:
1 x?Bluetooth 5.0 Module
