100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thic 100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thic 100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thic 100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thic 100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thic
100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thic 100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thic 100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thic 100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thic 100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thic

100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thic

New 10 available
R280.00
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R35.00 Standard shipping using one of our trusted couriers applies to most areas in South Africa. Some areas may attract a R30.00 surcharge. This will be calculated at checkout if applicable.
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The seller has indicated that they will usually have this item ready to ship within 15 business days. Shipping time depends on your delivery address. The most accurate delivery time will be calculated at checkout, but in general, the following shipping times apply:
 
Standard Delivery
Main centres:  1-3 business days
Regional areas: 3-4 business days
Remote areas: 3-5 business days
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Replacement Guarantee: 7 Days: We stand by this guarantee
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Product details

Condition
New
Location
International
Product code
TBD0606460301
Bob Shop ID
677744061
1. This 100PCS copper shim set is specifically designed for repairing Android smartphone CPUs, providing targeted heat dissipation after chip reballing or motherboard maintenance.
2. Precision-customized 12.4x14mm short-circuit prevention dimensions ensure full coverage of the chip surface without edge overhang, avoiding contact and short circuits with surrounding components.
3. Made of oxygen-free pure copper, significantly reducing chip temperature when used with thermal paste.
4. Three thickness options (0.1/0.3/0.5mm) available to fit different device models.
5. Replaces damaged OEM thermal materials after CPU rework, reducing the risk of device failure caused by inadequate factory-restored cooling.
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