1PC Thermal Release Film Single Sided Tape Graphene Film FOR Wafer Positioning 1PC Thermal Release Film Single Sided Tape Graphene Film FOR Wafer Positioning 1PC Thermal Release Film Single Sided Tape Graphene Film FOR Wafer Positioning
1PC Thermal Release Film Single Sided Tape Graphene Film FOR Wafer Positioning 1PC Thermal Release Film Single Sided Tape Graphene Film FOR Wafer Positioning 1PC Thermal Release Film Single Sided Tape Graphene Film FOR Wafer Positioning

1PC Thermal Release Film Single Sided Tape Graphene Film FOR Wafer Positioning

New 10 available
R619.00
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Regional areas: 3-4 business days
Remote areas: 3-5 business days
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Product details

Condition
New
Location
International
Product code
MSRR6176
Bob Shop ID
646300757
1PC Thermal Release Film Single Sided Tape Graphene Film FOR Wafer PositioningDescriptionProduct Name: Heat Release Tape, Heat Peel Tape, Foam Tape (Single sided Tape)Adhesive tape: There are low viscosity and high viscosityStructure: Two layer structure, one layer is a protective film; The first layer is the adhesive layer, which is made of PET film. The substrate thickness is 100 microns, and the adhesive layer thickness is 50 microns. The thick layer is the adhesive layer, and the thin layer is the protective film. The adhesive is a special thermosensitive adhesive.Stripping principle: Hot strip adhesive tape is made of a unique adhesive (thermosensitive adhesive) that has a certain adhesive force at room temperature and can play a positioning role. It can meet various precision processing requirements, heating the temperature from room temperature to the required temperature of the tape, and maintaining it for tens of seconds (up to 5 minutes) at the required temperature.The adhesive force of the tape will disappear, and the phenomenon of tape adhesion disappearing is that the tape turns white, which means that the adhesion disappears.Heat release tape can achieve simple peeling with minimal residue and does not contaminate the adhered material.Applicable: In the production process of electronic products, simple automation can be achieved. Mainly used in MLCC, MLCI, graphene film transfer, two-dimensional material transfer, nanotube transfer, wafer grinding positioning, circuit board installation, LED lamp production and other positioning.Dissolution: The adhesive of the heat release tape can dissolve in a solution of ethyl acetate.Instructions for use1. Store at room temperature and in a cool place. It has viscosity at room temperature and can play a positioning role, meeting various precision machining needs. You can use scissors to cut, and according to the size you need, you can cut it yourself.2. It needs to be heated to the set temperature for about tens of seconds (up to 5 minutes), and the viscosity will disappear to achieve simple peeling. When heating, the temperature should not exceed the set temperature of the tape. For example, if the tape is between 90 and 100 , the temperature should not exceed 120 degrees Celsius. If it exceeds 100 to 105 degrees Celsius, it is acceptable. However, if the temperature is exceeded too much, anti sticking phenomenon may occur and the adhesion will not disappear.Application: Heat release tape can be used in fields such as chips, semiconductors, positioning cutting, grinding, thinning, protection, nanomaterials, high-end small components, mobile phone glass, cameras, graphene film transfer, etcShelf life: Try to use it up within six months as much as possiblePackage Included1 x Film
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