2UUL BH13 Midreball Base Logic Board BGA Reballing Platform Set for iPhone 12-16 Pro Max 2UUL BH13 Midreball Base Logic Board BGA Reballing Platform Set for iPhone 12-16 Pro Max 2UUL BH13 Midreball Base Logic Board BGA Reballing Platform Set for iPhone 12-16 Pro Max 2UUL BH13 Midreball Base Logic Board BGA Reballing Platform Set for iPhone 12-16 Pro Max 2UUL BH13 Midreball Base Logic Board BGA Reballing Platform Set for iPhone 12-16 Pro Max 2UUL BH13 Midreball Base Logic Board BGA Reballing Platform Set for iPhone 12-16 Pro Max 2UUL BH13 Midreball Base Logic Board BGA Reballing Platform Set for iPhone 12-16 Pro Max
2UUL BH13 Midreball Base Logic Board BGA Reballing Platform Set for iPhone 12-16 Pro Max 2UUL BH13 Midreball Base Logic Board BGA Reballing Platform Set for iPhone 12-16 Pro Max 2UUL BH13 Midreball Base Logic Board BGA Reballing Platform Set for iPhone 12-16 Pro Max 2UUL BH13 Midreball Base Logic Board BGA Reballing Platform Set for iPhone 12-16 Pro Max
2UUL BH13 Midreball Base Logic Board BGA Reballing Platform Set for iPhone 12-16 Pro Max
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2UUL BH13 Midreball Base Logic Board BGA Reballing Platform Set for iPhone 12-16 Pro Max

New 10 available
Indicative market price: R3,448.00
R1,724.00
50% off
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R35.00 Standard shipping using one of our trusted couriers applies to most areas in South Africa. Some areas may attract a R30.00 surcharge. This will be calculated at checkout if applicable.
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The seller has indicated that they will usually have this item ready to ship within 15 business days. Shipping time depends on your delivery address. The most accurate delivery time will be calculated at checkout, but in general, the following shipping times apply:
 
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Main centres:  1-3 business days
Regional areas: 3-4 business days
Remote areas: 3-5 business days
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Product details

Condition
New
Location
International
Product code
EDA0085169
Bob Shop ID
661554779
1. Precisely engineered to fit 12/13/14/15 and 16 series logic board repair.
2. Ensures stable alignment of chips and logic boards during reballing for higher success rates.
3. Quick replacement and secure fixation improve repair efficiency, ideal for frequent use.
4. Built with high-strength, heat-resistant alloy for long-lasting performance under repeated use.
5. Specially developed for motherboard-level IC reballing and BGA rework, meeting the needs of repair experts.
6. User-friendly design allows even less experienced technicians to work efficiently and with confidence.


EDA0085169
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