7 Bottles of 12.5K 0.25/0.3/0.35/0.4/0.45/ 0.5/0.6mm Soldering Ball Lead Solder Ball Set for BGA Reb

It is of good electrical conductivity and mechanical connection performance.With this product, it will not be necessary to clean up the welding plate, and directly drag the tin point on the main plate and bridge for BGA welding, which will be faster and 't damage the welding plate due to mistakes.Widely used in tinplate, flux, organic synthesis, chemical production, alloy manufacturing, and assembly of multiple integrated circuits in the electronics industry.Colour:SilverMaterial:tinSize:0.25-0.6mmPackage Contents:7 Bottles x Soldering BallOnly the above package content, other products are not included.Note: Light and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +\/- 1-3cm.