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Heat Sink, For Ball Grid Array, Push-Pin, 10.5 °C/W, BGA, 49 mm, 10 mm, 49 mmProduct InformationThermal Resistance: 10.5°C/WPackages Cooled: BGAExternal Width - Metric: 49mmExternal Height - Metric: 10mmExternal Length - Metric: 49mmHeat Sink Material: AluminiumExternal Width - Imperial: 1.93"External Height - Imperial: 0.39"External Length - Imperial: 1.93"Product OverviewThe BGA-PP-015 is a 49 x 49 x 10mm push-pin Heat Sink with thermal tape. Thisheat sink is made of aluminium and natural anodized finish and verticallymounted fin. This BGA series heat sink is suitable for use with ball grid array.ApplicationsIndustrial