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Heat Sink, For Ball Grid Array, Standard, 26.5 °C/W, BGA, 14 mm, 10 mm, 14 mmProduct InformationThermal Resistance: 26.5°C/WPackages Cooled: BGAExternal Width - Metric: 14mmExternal Height - Metric: 10mmExternal Length - Metric: 14mmHeat Sink Material: AluminiumExternal Width - Imperial: 0.55"External Height - Imperial: 0.39"External Length - Imperial: 0.55"Product OverviewThe BGA-STD-015 is a 14mm standard Heat Sink with aluminium, black anodized,thermal tape, 26.5°C/W thermal resistance. This heat sink features excellentthermal conductivity, cushioning and gap filling properties, the pad is an idealthermal interface material specifically designed for heat sink attachment toMPU, chip set and other plastic encapsulated components. It consists of analuminium foil backing coated, on both sides with a very high temperatureresistance acrylic adhesive. Due to its high heat performance and adhesiveproperties this tape can also be use to attach components to a vertical heatsink and to metal enclosure surfaces.0.27mm ThicknessApplicationsHVAC
