Arctic Thermal Pad High Performance Gap Filler

Product Overview
Arctic Thermal Pad bridges problem-free even large spaces. After multiple awards with its thermal pastes, Arctic is now offering thermal pads as well. As perfect gap filler the Thermal Pad provides an optimal heat transfer and bridges even large height differences and uneven surfaces.

Often it is troublesome to cool diverse components like memory chips, CPUs, MCUs, DSPs and other ICs densely packed. Different heights prevent a proper contact to the heat sink and thus make it useless. The thermal pad is perfect to close even large spaces completely. Due to its low hardness this silicon pad adapts ideally to uneven surfaces, also at low pressure and thus ensures the best possible heat dissipation. In the comparison test the Thermal Pad with its special filler and a high thermal conductivity can demonstrate its performance and leaves the competitors behind.

Features

Specifications
• Thermal Conductivity-6.0 W/mK
• Hardness-25 Shore 00
• Thickness 0.5 mm or 1.0 mm or 1.5 mm
• Specific Gravity-3.2 g/cm3
• Volume resistance-1 X 1012 Ω-cm
• Breakdown Voltage 12 KV/mm
• Continuous Use Temperature -40~200 ℃
• Tensile strength 2.5 Kgf/cm²
• Elongation 45 %
• UL Flammability V-0