BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting ... BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting ... BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting ... BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting ... BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting ... BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting ... BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting ...
BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting ... BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting ... BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting ... BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting ...
BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting ...
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BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting ...

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R241.58
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R35.00 Standard shipping using one of our trusted couriers applies to most areas in South Africa. Some areas may attract a R30.00 surcharge. This will be calculated at checkout if applicable.
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The seller has indicated that they will usually have this item ready to ship within 15 business days. Shipping time depends on your delivery address. The most accurate delivery time will be calculated at checkout, but in general, the following shipping times apply:
 
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Main centres:  1-3 business days
Regional areas: 3-4 business days
Remote areas: 3-5 business days
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Product details

Condition
New
Location
International
Product code
TBD06060300
Bob Shop ID
648230136

1. Lead-free Solder Paste is a high-performance, no-clean soldering solution designed for precision electronics assembly and repair. Ideal for BGA applications, it delivers exceptional conductivity, reliability, and efficiency while minimizing post-weld residue.
2. Strong Adhesion & Extensibility: Provides robust attachment to solder joints and retains flexibility after cooling, ensuring long-term durability.
3. Advanced Membrane Removal Technology: Reduces net scraping frequency during operation, improving workflow efficiency by up to 30%.
4. No-Clean & Eco-Friendly Formula: Leaves very little residue, eliminating post-weld cleaning. High resistance ensures stability in demanding conditions.
5. Particle Size: 35-45 microns
6. Melting Point: 138 degrees Celsius
7. Recommended Temperature: 160170 degrees Celsius
8. Net Weight: 35g

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