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35g High Thermal Conductivity No-Clean Flux, Melting Point 183°C for BGA Repair, SMD Welding & PCB Circuitry (Deep Gray), Electronics Repair, Metallic Cap Lid, No-Clean Residue
This solder paste is a high-performance soldering paste suitable for soldering electronic components.
Features:
Good wettability: It can quickly wet the welding surface and form a uniform and smooth solder joint.
Stable welding performance: It can provide stable welding effect and reduce the occurrence of welding defects.
High-purity materials: ensure the conductivity and reliability of solder joints.
Easy to Use : The paste has moderate viscosity and is easy to use and print
Solder paste should be stored at 1-10°C. The solder paste temperature should be raised to ambient temperature (25°C) before opening, and the temperature recovery time is about 3-4 hours. Solder paste should last 6 months. Solder paste should not be left in the sun
