BGA Chip Pressure Pin Kit to Prevent ChipFrom Moving During Soldering

Hold your BGA chip in place while soldering / Reflowing 
Feature:
1. Reliable IC Welding: This pressure needle burning tool kit is designed to prevent welding failures caused by the movement of ICs, especially those with thin legs. It securely holds and fixes the IC in place, making the welding process easier and more successful.
2. Adjustable Probe Height and Length: The upper part of the welding fixed test probe  can be pulled out, allowing for precise control of the height and length of the pins. With multiple combinations, it can serve as a versatile testing fixture for various applications.
3. Excellent Material: Made with high-quality materials and meticulous craftsmanship, this ic chip module ensures durability and long-lasting performance.
4. Flexible Arm Adjustments: The arm can be adjusted vertically, horizontally, and can rotate 360 degrees, providing maximum flexibility and convenience for different welding scenarios.
5. Lightweight and Portable: With its lightweight design, this soldering fixed test probe is easy to carry around, allowing you to take it anywhere and use it whenever needed.

Contents : Pressure pin kit Only - This kit needs a metal plate to sit on - It has a powerful magnet that needs to attach to a metal surface