Black - M5Stack LLM AX630C Large Language Model Module Development Kit Dual Cortex AI Processor 4GB

Specifications:

Specification	Parameter
Processor SoC	AX630C@Dual Cortex A53 1.2 GHz
	MAX.12.8 TOPS @INT4, 3.2 TOPS @INT8
Memory	4GB LPDDR4 (1GB system memory + 3GB dedicated to hardware acceleration)
Storage	32GB eMMC5.1
Communication	Serial communication, default baud rate 115200@8N1 (adjustable)
Microphone	MSM421A
Audio Driver	AW8737
Speaker	8@1W, size: 2014 cavity speaker
Built-in Functions	KWS (wake word), ASR (speech recognition), LLM (large language model), TTS (text-to-speech)
RGB LED	3x RGB LED@2020, driven by LP5562 (status indicator)
Power Consumption	No load: [email protected], Full load: [email protected]
Button	Used to enter firmware download mode
Upgrade Interface	SD card/Type-C port
Conversion Chip	CH340N
Ethernet Interface	RJ45 interface with onboard network transformer (11FB-05NL SOP-16)
Serial Interfaces	FPC-8P interface, Type-C interface, RJ45 interface
DIY Expansion	HT3.96*9P solder pad
Operating Temp.	0-40°C
Product Size	Module LLM: 54.0 x 54.0 x 13.0mm
	Module13.2 LLM Mate: 54 x 54 x 19.7mm
Package Size	Module LLM: 192.0 x 95.0 x 17.0mm
	Module13.2 LLM Mate: 192.0 x 95.0 x 21.0mm
Product Weight	Module LLM + Module13.2 LLM Mate : 36.7g

Introduction:1. Module LLM Kit is a smart modular kit focused on offline AI inference and data communication interface applications. It integrates the Module LLM and Module13.2 LLM Mate modules to meet the offline AI inference and data interaction requirements across various scenarios.2. Module LLM is an integrated offline large language model (LLM) inference module designed specifically for terminal devices that require efficient and intelligent interaction. Whether for smart home applications, voice assistants, or industrial control, Module LLM delivers a smooth and natural AI experience without relying on the cloud, ensuring privacy, security, and stability.3. Module13.2 LLM Mate Module provides a variety of interface functions to facilitate system integration and expansion. It achieves stacked power supply with Module LLM via the M5-Bus interface; its built-in CH340N USB conversion chip offers USB-to-serial debugging functionality, while the Type-C interface is used for USB log output. Additionally, the RJ45 interface works with the onboard network transformer to extend to a 100 Mbps Ethernet port and core serial port (supporting SBC applications); the FPC-8P interface connects directly to Module LLM, ensuring stable serial communication; furthermore, an HT3.96*9P solder pad is reserved for DIY expansion.4. The Module LLM module integrates