Specifications:
SoC: ESP32-P4NRW32 (RISC-V 32-bit high-performance dual-core processor 360 MHz + RISC-V 32-bit single-core low-power coprocessor 40 MHz)
Flash: 16MB
PSRAM: 32MB
DC-DC: SY8089AAAC
Overvoltage Protection: AW32901FCR, supports input voltage protection greater than 6V
Input Voltage: DC 5V
Module Resource Interface: USB, UART, I2C, RMII, GPIO, MIPI CSI, MIPI DSI
Stamp Hole Lead-out Interface: 44 x GPIO (G0-G39, C41, G49, G50, G52); MIPI DSI (2-lane); USB HOST (USB2 OTG D+/-); CHIP_EN
Module Packaging: SMT: 1.27 / 2.00mm; DIP: 2.54mm
BTB Expansion Interface: SDIO, MIPI CSI (2-lane)
BTB Interface Specification: MIPI CSI: AXE516127D; SDIO: HC-PBB40C-20DS-0.4V-2.5-02
Operating Temperature: 0 ~ 40°C
Product Size: 29.8 x 22.0 x 4.3mm
Product Weight: 2.7g
Introduction:Stamp-P4 is a high-performance embedded module based on the ESP32-P4NRW32 chip. The module features a 32-bit RISC-V high-performance dual-core processor (360 MHz) and a single-core low-power coprocessor (40 MHz), integrated with a 16MB Flash + 32MB PSRAM storage combination. It can stably support complex applications such as image processing, UI rendering, and edge AI inference. In terms of multimedia and human-machine interaction, the chip integrates a MIPI-CSI camera interface and a MIPI-DSI high-definition display interface, combined with a hardware-level H.264 encoder, ISP image signal processor, and PPA pixel processing accelerator, enabling smooth audio-video capture, encoding, and graphical UI display. The module interfaces are compatible with 1.27mm/2.00mm pitch SMT packaging and 2.54mm pitch DIP male/female headers. It supports high-speed communication peripherals such as USB 2.0 OTG HS, Ethernet (GMAC), and SDIO 3.0, making it easy to integrate into various PCB designs and helping developers quickly complete product prototypes and application deployment.
Features:
1. Powered by the ESP32-P4NRW32 with a 360 MHz dual-core high-performance processor and a 40 MHz low-power coprocessor for complex embedded applications.
2. Built-in 16MB Flash and 32MB PSRAM provide the storage combination needed for image processing, UI rendering, and edge AI inference.
3. Supports MIPI CSI 2-lane camera interface and MIPI DSI 2-lane display interface for advanced multimedia and graphical UI applications.
4. Provides USB 2.0 OTG HS, RMII Ethernet expansion, and SDIO 3.0 expansion for high-speed communication and flexible integration.
5. Compatible with 1.27mm/2.00mm SMT packaging and 2.54mm DIP headers, supporting SMT, DIP, and fly-wires application forms.
Package Included:
