Cooler Master 1mm Heat Sink Thermal Compound Pad Pro Blue TPY-NDPB-9010-R1

Cooler Master 1mm Heat Sink Thermal Compound Pad Pro Blue

Cooling Versatility Everywhere Thermal Pad Pro

Cooler Master's new Thermal Pad Pro is an innovative solution to device cooling for a vast range of your electronic devices and components.

Formulated with Nano Diamond Particles

15.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.

Non-toxic and Non-corrosive

Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.

Double-sided Adhesive

Provides seamless and secure contact between surfaces.

Wide Range of Application

Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.

Versatile and Easy Application

Easily cut to the perfect size for your application. Choices of 1mm and 2mm thickness are available.

Technical Specification

Product: Cooler Master Thermal Pad Pro. Type: Thermal pad, Thermal conductivity: 15.3 W/m·K, Density: 3.4 g/cm³. Width: 45 mm, Depth: 95 mm, Height: 1 mm. Quantity per pack: 1 pc(s), Package width: 170 mm, Package depth: 82 mm. Master (outer) case width: 200 mm, Master (outer) case length: 320 mm, Master (outer) case height: 192 mm