Main centres: | 1-3 business days |
Regional areas: | 3-4 business days |
Remote areas: | 3-5 business days |
Please note: This product is not in stock with us and will need to ordered from our suppliers.
Current stock status: dispatched in 2-5 working days (The stipulated shipping time is how long the product will take to reach us before we send it to you. Please note that we DO NOT keep stock of this item, and order from our suppliers as needed. Because of this stock discrepancies may arise i.e. a product is out of stock with our suppliers.)
ThermalFusion 400 is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications.
Features:
Specifications:
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Thermal Conductivity |
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Volume Resistivity |
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BLT (Bond Line Thickness) |
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Volatile content |
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