EMCP162/168 Flip Shrapnel To USB Test Socket EMCP Programming Socket Mobile Phone Font Read-Write So
EMCP162/168 Flip Shrapnel To USB Test Socket EMCP Programming Socket Mobile Phone Font Read-Write So
EMCP162/168 Flip Shrapnel To USB Test Socket EMCP Programming Socket Mobile Phone Font Read-Write So
EMCP162/168 Flip Shrapnel To USB Test Socket EMCP Programming Socket Mobile Phone Font Read-Write So

EMCP162/168 Flip Shrapnel To USB Test Socket EMCP Programming Socket Mobile Phone Font Read-Write So

New
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10 available
R2,400.00
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Main centres:  1-3 business days
Regional areas: 3-4 business days
Remote areas: 3-5 business days
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Product details

Condition
New
Location
International
Product code
TBD05517577
Bob Shop ID
614656943

EMCP162/168 Flip Shrapnel To USB Test Socket EMCP Programming Socket Mobile Phone Font Read-Write Socket



1. Type: test block
2. Working frequency: high frequency
3. Application: integrated circuit IC
4. Interface type: terminal
5. Production process: injection molding
6. Features: stable testing
7. Contact material: beryllium copper shrapnel
8. Insulator material: PET
9. Number of cores: 17
10. Purpose: programming socket, test socket, for testing, reading and writing of EMCP IC chips
11. Lead spacing: 0.5mm
12. Service life: 100,000 times

Testing method:
1. Select the limit frame that matches the IC, and place the IC flat in the SOCKET according to the direction
2. Plug the USB cable into the USB port of the computer, turn on the power switch of the socket, and select the corresponding test program

Features:
1. Also compatible with 186-FBGA 162-FBGA
2. The shrapnel is made of imported beryllium copper by high-precision die stamping, and the head-shaped probe is designed to be hardened and thickened in the later stage to ensure product stability and durability.
3. Support hot plugging and separate power switch, support for testing through the USB interface or through the connection with the board on the board corresponding to the PIN
4. Using floating board structure, precise positioning, convenient IC picking and placement, higher work efficiency
5. The test board is welded to the adapter board, the test socket does not need to be soldered, and the pinholes are inserted into the adapter board

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