| Main centres: | 1-3 business days |
| Regional areas: | 3-4 business days |
| Remote areas: | 3-5 business days |
SPECIFICATIONS
Q8300
| Package Specifications | |
| TCASE | 71.4°C |
| Package Size | 37.5mm x 37.5mm |
| Processing Die Size | 164 mm2 |
| # of Processing Die Transistors | 456 million |
| Sockets Supported | LGA775 |
| Halogen Free Options Available | Yes |