Main centres: | 1-3 business days |
Regional areas: | 3-4 business days |
Remote areas: | 3-5 business days |
SPECIFICATIONS
Q8300
Package Specifications | |
TCASE | 71.4°C |
Package Size | 37.5mm x 37.5mm |
Processing Die Size | 164 mm2 |
# of Processing Die Transistors | 456 million |
Sockets Supported | LGA775 |
Halogen Free Options Available | Yes |