Main centres: | 1-3 business days |
Regional areas: | 3-4 business days |
Remote areas: | 3-5 business days |
Processor core | Sandy Bridge |
Manufacturing process | 0.032 micron High-K metal gate process |
Data width | 64 bit |
The number of cores | 2 |
The number of threads | 2 |
Floating Point Unit | Integrated |
Level 1 cache size | 2 x 32 KB instruction caches 2 x 32 KB data caches |
Level 2 cache size | 2 x 256 KB |
Level 3 cache size | Shared 2 MB |
Cache latency | 4 (L1 cache) 12 (L2 cache) 27 (L3 cache) |
Physical memory (GB) | 32 |
Multiprocessing | Uniprocessor |
Features |
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Low power features | Enhanced SpeedStep technology |
On-chip peripherals |
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Electrical/Thermal parameters | |
Maximum operating temperature (°C) | 69.1 |
Thermal Design Power (W) | 65 |