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| Main centres: | 1-3 business days |
| Regional areas: | 3-4 business days |
| Remote areas: | 3-5 business days |
| Processor core | Sandy Bridge |
| Manufacturing process | 0.032 micron High-K metal gate process |
| Data width | 64 bit |
| The number of cores | 2 |
| The number of threads | 2 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 2 x 32 KB instruction caches 2 x 32 KB data caches |
| Level 2 cache size | 2 x 256 KB |
| Level 3 cache size | Shared 2 MB |
| Cache latency | 4 (L1 cache) 12 (L2 cache) 27 (L3 cache) |
| Physical memory (GB) | 32 |
| Multiprocessing | Uniprocessor |
| Features |
|
| Low power features | Enhanced SpeedStep technology |
| On-chip peripherals |
|
| Electrical/Thermal parameters | |
| Maximum operating temperature (°C) | 69.1 |
| Thermal Design Power (W) | 65 |
