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Description
This high conductivity thermal compound is produced particularity for overclockers.
It is made of silver material by nanometer production process.
It's other various materials are also with much better properties than regular thermal compounds.
Spreading small amount thermal compound on chipset surface or heatsink bottom,
it enhances heat dissipation performance tremendously.
Specifications
Color Grey
Thermal Conductivity > 4.5 W/m .° C
Thermal Resistance < 0.205 ° C - in / W
Specific Gravity > 2.5
Operation Temperature - 50 ~ 240 ° C
Net Weight 3 g
