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JP-19 Thermostatic Soldering Platform for iPhone X / XS / XS Max Motherboard layering Upper Lower Se
New
R1,200.00
Closed
6 May 24 02:40
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ready to ship within 15 business days. Shipping time depends on your delivery address. The most
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Standard Delivery
| Main centres: | 1-3 business days |
| Regional areas: | 3-4 business days |
| Remote areas: | 3-5 business days |
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Product details
Condition
New
Location
International
Product code
ETP1120
Bob Shop ID
613280621
1. Support 110V/220V two kinds of voltage, the temperature is 200 degree centigrade.
2. Constant high temperature, porous heat dissipation, one-key separation.
3. Double step positioning, safe disassembly, detachable and weldable.
4. Positioning degumming tank, all kinds of chips easy degumming.
5. Silica gel is completely surrounded, anti-slip and heat-resistant to prevent current leakage.
6. High purity copper plate, extension design, professional welding tools.
7. High precision CNC machining, heat evenly without damage to the motherboard.
2. Constant high temperature, porous heat dissipation, one-key separation.
3. Double step positioning, safe disassembly, detachable and weldable.
4. Positioning degumming tank, all kinds of chips easy degumming.
5. Silica gel is completely surrounded, anti-slip and heat-resistant to prevent current leakage.
6. High purity copper plate, extension design, professional welding tools.
7. High precision CNC machining, heat evenly without damage to the motherboard.