Main centres: | 1-3 business days |
Regional areas: | 3-4 business days |
Remote areas: | 3-5 business days |
UNITED CELLULAR
Suitable for desoldering and soldering of various components, such as: SOIC CHIP QFP PLCC BGA SMD. (especially suitable for the desoldering of mobile phone cables and cable holders)
For heat shrinking, drying, paint removal, degreasing, thawing, preheating.
Applicable to the power supply during mobile phone maintenance, test the voltage of the circuit board, check the strength of the mobile phone RF signal.
Model: 903D
Power: ?800W
Size: 250 185 175mm
Weight: 3.85kg
Working environment: 0~50 C
Storage environment: -20-80 C
Storage humidity: 35%-45%
Air gun part:
Airflow type: brushless fan soft wind
Merry: ?120L/min
Temperature range: 100 C ~ 480 C
Temperature stability: 1 C
Display form: digital display
Soldering iron part:
Temperature range: 200 C ~ 480 C
Temperature stability: 2 C
Ground voltage: <2mV
Grounding resistance: <20HM
Power section
Output voltage: DC 0V-15V
Load stability: <0.01 2MV
Temperature coefficient: <300ppm/ C
Ripple noise: <1mrms (effective value)
Protection current: 1A-3A