Main centres: | 1-3 business days |
Regional areas: | 3-4 business days |
Remote areas: | 3-5 business days |
Features:
High-precision circuit board soldering SMT, BGA soldering processes, etc.
Adapted to the mobile phone repair industry, computer digital service industries, etc.
The quality of solder paste, excellent wetting, high reliability.
Can effectively prevent the collapse of the printing and preheat,
Tack lasting, easy to dry, sticky time for more than 48 hours.
A colourless transparent, does not affect the test, fine-clean and cleaning performance.
Products wetting, anti-dry and strong, long shelf life at room temperature
Specification:
Material: tin + solder paste
Colour: As per picture
Size: Approx. 33 x 32 x 29mm
Type: XG-Z40
Alloy: Sn63/Pb37
Microns: 25-45um
Volume: 10cc
Melting Point: 183°C
Storage: 0~10°C
Includes needle type applicator.