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1. High-Precision BGA Reballing Stencil: The Mijing IPH-21 is specifically designed for iPhone 16 series, ensuring precise alignment and perfect soldering for each solder point. 2. Enhanced Durability: The surface is specially treated to enhance wear resistance, prolonging the stencils lifespan. 3. Made from high heat-resistant and non-deformable materials, ensuring long-term stability and reliability during use. 4. Easy Operation Design: The stencil design is user-friendly, suitable for all types of technicians, allowing operation without professional training. 5. Enhanced Soldering Quality: With precise hole design, it effectively improves soldering quality, preventing shorts and cold joints. 6. High-Temperature Resistance: Capable of withstanding high temperatures during the soldering process without deforming.