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Product Information:Flux Type: No Clean and Rosin FluxSolder Alloy: 99.3, 0.7 Sn, CuExternal Diameter - Metric: 0.7mmExternal Diameter - Imperial: 0.028"Melting Temperature: 227°CWeight - Metric: 500gWeight - Imperial: 1.102lbProduct Range: Multicomp Type 505 Solder WireProduct OverviewMulticomp Typ 505 solid fluxes for cored solder wires have been speciallyformulated to complement no clean wave and reflow soldering processes. They arealso applicable to repair operations carried out after a cleaning process,eliminating the need for further cleaning. Multicomp flux cored solder wiresprovide fast soldering on copper and brass surfaces as well as solder coatedmaterials. Activity of the halide activated versions on nickel is also gooddepending on the state of oxidation of the nickel finish. The good thermalstability of fluxe 505 means, they are also well suited to solderingapplications requiring high melting temperature alloys.Mildly activated no-clean flux formulationIncreased flux content (3% by weight) - low fuming and low spittingMinimal clear residues do not require cleaningComplies with all lead-free legislative requirementsSuitable for general lead-free, no-clean assembly, or rework of PCBs assembledin a lead-free no-clean