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Product Information:- Breadboard Type: Solderless Breadboard- Total Number of Tie Points: 750Tie Points- No. of Distribution Strips / Buses: 3Bus Strips- No. of Terminal Strips: 2 Terminal Strips- Board Dimensions (L x W) - Imperial: 3.23" x 3.89"- Board Dimensions (L x W) - Metric: 82mm x 99mmProduct Overview:Great value and wide range of prototyping breadboards. Get prototyping yourdesign with our range of solderless breadboards from Multicomp. Available invarious sizes and configurationsSpecification:- Pitch spacing is 2.54mm- Two terminal strips with 600 tie-points and three distribution strips with 150tie-points- Rated voltage is 300V- Rated current is 3A to 5A- Insulation resistance is 500Mohm at 500VDC- Withstanding voltage is 1000VAC- 1min- Wire size range from 29AWG to 20AWG- Temperature range from -25°C to +80°C- 7mm to 8mm strip length, dimension of the board is 99mm x 82.1mm (L x W)