New Environmental Protection Suction Aspiration Tin Line Motherboard BGA Pad Remov... (MODEL: 3.5MM)
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Product details
Condition
New
Location
International
Bob Shop ID
615186219
SELECTED OPTION:
MODEL: 3.5MM
Description :
New Environmental Protection Suction Aspiration Tin Line Motherboard BGA Pad Removed Off Tin Solder Wire ? Features :
1. The use of pure copper and special chemicals refined, to ensure that the use of good, fast, provincial.
2. For the addition of tin to absorb excess solder, oxidation resistance, thermal conductivity, tin effect is very good, suction tin clean.
Use steps:
1. Place the wick over the solder to be removed. Push the heated soldering iron tip onto the wick. The melted solder will be absorbed. 2. Remove both the soldering wick and the soldering iron tip from the PCB. 3. Use nippers to cut off the used part of the wick.
? Package Includes :
1 x 1.5mm/2.0mm/2.5mm/3.0mm/3.5mm?Solder Wire ? Details Pictures :
