Main centres: | 1-3 business days |
Regional areas: | 3-4 business days |
Remote areas: | 3-5 business days |
AMD just released a slew of new chips to fill in some gaps in their current line-up. Here today we have the fastest of this release, the AMD Phenom II x6 1075T 3.0GHz. This beast sits in between the existing 1055T and 1090T. This gives AMD three consumer level 6 core processors while Intel has none. And to top it all off, you can get those i7 speeds at i5 prices.
Just like the other 6-cores, the 1075T sports AMDâs new Turbo CORE system. This system is similar to Intelâs Turbo boost system, only a little bit different. With Intelâs Turbo Boost, when the processor is running below optimal power thresholds the processor will overclock 1-4 of the 4 cores to get the job done faster. AMDâs system is a little more straight forward: If the task is better suited to raw speed over multiple cores, the processor will switch from 6 cores to 3 turbocharged cores. The 1075T can go from 3.0GHz to 3.5GHz, making it one fast processor.
Phenom II⢠X6 1075T Processor:
Model Number & Core Frequency: X6 1075T / 3.5GHz (Turbo) / 3.0GHz (Base)
OPN: HDT75TFBK6DGR
L1 Cache Sizes: 64K of L1 instruction and 64K of L1 data cache per core (768KB total L1 per processor)
L2 Cache Sizes: 512KB of L2 data cache per core (3MB total L2 per processor)
L3 Cache Size: 6MB (shared)
Total Cache (L2+L3): 9MB
Memory Controller Type: Integrated 128-bit wide memory controller *
Memory Controller Speed: Up to 2.0GHz with Dual Dynamic Power Management
Types of Memory Supported: Unregistered DIMMs up to PC2-8500 (DDR2-1066MHz) -AND- PC3-10600 (DDR3-1333MHz)
HyperTransport 3.0 Specification: One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz x2)
Total Processor-to-System Bandwidth: Up to 37.3GB/s total bandwidth [Up to 21.3 GB/s memory bandwidth (DDR3-1333) + 16.0GB/s (HT3)]
Up to 33.1GB/s total bandwidth [Up to 17.1 GB/s memory bandwidth (DDR2-1066) + 16.0GB/s (HT3)]
Packaging: Socket AM3 938-pin organic micro pin grid array (micro-PGA)
Fab location: GLOBALFOUNDARIES Fab 1 module 1 in Dresden, Germany (formerly AMD Fab 36)
Process Technology: 45-nanometer DSL SOI (silicon-on-insulator) technology
Approximate Die Size: 346mm2
Approximate Transistor count: Similar to Istanbulâs ~904 million
Max TDP: 125 Watts
AMD Codename: âThubanâ