Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series
Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series
Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series
+5

Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series

New 10 available
Indicative market price: R1,178.00
R785.00
33% off
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R35.00 Standard shipping using one of our trusted couriers applies to most areas in South Africa. Some areas may attract a R30.00 surcharge. This will be calculated at checkout if applicable.
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The seller has indicated that they will usually have this item ready to ship within 15 business days. Shipping time depends on your delivery address. The most accurate delivery time will be calculated at checkout, but in general, the following shipping times apply:
 
Standard Delivery
Main centres:  1-3 business days
Regional areas: 3-4 business days
Remote areas: 3-5 business days
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Product details

Condition
New
Location
International
Bob Shop ID
654481164

Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series

1. Middle frame reballing platform, precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge
2. To show the beauty of design in a compact shape, motherboard reballing without worry is compact and easy, saving space
3. Magnet sliding dislocation design, smart application of the sliding dislocation design, easy to take
4. CNC high-precision integrated processing, stable positioning for the motherboard, no deviation in reballing
5. Strong magnetic attraction, accurate positioning no offset, and encountering high-temperature magnetism will not weaken
6. High-temperature magnetic strong pressing prevents the stencils from bulging caused by high-temperature


EDA006242102
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