Qianli Middle Layer Reballing Platform for Phone 11 X XS XSMAX Motherboard BGA ... (TYPE: 11PRO/MAX)

Qianli Middle Layer Reballing Platform for Phone 11 X XS XSMAX Motherboard BGA ... (TYPE: 11PRO/MAX)

20 available / new
R810.00
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R35.00 Standard shipping using one of our trusted couriers applies to most areas in South Africa. Some areas may attract a R30.00 surcharge. This will be calculated at checkout if applicable.
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The seller has indicated that they will usually have this item ready to ship within 12 business days. Shipping time depends on your delivery address. The most accurate delivery time will be calculated at checkout, but in general, the following shipping times apply:
 
Standard Delivery
Main centres:  1-3 business days
Regional areas: 3-4 business days
Remote areas: 3-5 business days
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Product details

Condition
New
Location
International
Bob Shop ID
645884416

SELECTED OPTION:
TYPE: 11PRO/MAX

Specification:


Model Number: Qianli BGA Reballing Fixture

Application: Computer Tool Kit

Size: 10x5x4cm

Application: Mainboard Soldering repair

Type: Repair Fixture

Application 1: for iphone xs Mainboard Soldering repair

Application 2: for iphone xsmax Mainboard Soldering repair

Application 3: for iphone x Mainboard Soldering repair

Application 4: for iphone 11 11Pro 11ProMax Mainboard Soldering repair


Package included:


1 x BGA Reballing Fixture



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