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1. Power: 1300W 2. Input: AC110-220V, 50HZ/60HZ 3. Airflow range: 1-200 4. Temperature range: 100-550 degrees Celsius / 212-1022 degrees Fahrenheit 5. Heating core: plug-in ceramic heating core 6. Weight: about 7.85kg 7. Size: about 26 x 19 x 17.5cm
Features: 1. Suitable for SOIC, CHIP, QFP, PLCC, BGA and other original disassembly, soldering 2. 3 heating mode, four temperature air volume storage memory 3. Air flow infinitely adjustable, up to 200 levels of air output 4. Multi-function menu, three large screen intelligent digital display 5. One key to set the cold air / sound switch, temperature / air volume multiplier fast adjustment, Celsius / Fahrenheit free switching 6. 3s to warm up, 130W high power, easy to dismantle the solder melt tin 7. Pluggable heating core / handle, convenient operation