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Description: ? Chip model: TEC1-12703 Dimensions: 40*40*4.3mm Component logarithm 127 Wire size: lead length 310mm ± 5mm RV standard wire single head 5mm tinned Internal resistance: 4.0~4.3?? (ambient temperature 23±1?ᆪC, 1KHz Ac test) Maximum temperature difference: Tmax (Qc=0) above 63?ᆪC Working current: Imax=3A (when starting at 15.5V) Rated voltage: DC 12V (Vmax: 15.5V) Cooling power: Qcmax 27W Assembly pressure: 85N/cm2 Working environment: temperature range -55 ?ᆪ C ~ 83 ?ᆪ C (excessive ambient temperature drop directly affects cooling efficiency) Packaging process: around with standard 704 silicone rubber seal Storage conditions: -40 ?ᆪ C ~ 60 ?ᆪ C ? Note: ? There is a literal surface for the cooling surface, and no literal surface is the cooling surface. A heat sink or water-cooled must be installed on the heat sink surface, otherwise, it will burn out. (Please coating thermal silica gel regardless of water cooling or air cooling)