| Main centres: | 1-3 business days |
| Regional areas: | 3-4 business days |
| Remote areas: | 3-5 business days |
Designed for use in transferring heat away from electrical and electronic devices such as;
transistors, power diodes, semiconductors, ballast's and thermo-couple wells. High thermal
conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal
chassis, will not dry or harden
Characteristics
