Thermal Paste

Characteristics

• High thermal conductivity
•  High dielectric constant
• High dissipation factor
• Use with heat sinks or metal chassisWill not dry or harden
• Contains zinc oxides and polydimenthyl siloxane
• Non-silicone version available
  Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semiconductors,ballast's and thermo couple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use
  with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl Siloxane.

Should you be located in the greater Johannesburg Or Pretoria area we can deliver.  Please inquire if your order qualifies for delivery.  Allow 2-3 working days for delivery.