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Thermaltake TG-30 Thermal Heat Sink Compound Paste CL-O023-GROSGM-A
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Thermaltake TG-30 Thermal Heat Sink Compound Paste CL-O023-GROSGM-A

2 were available / new
Indicative market price: R230.00
R220.00
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The seller has indicated that they will usually have this item ready to ship within 3 business days. Shipping time depends on your delivery address. The most accurate delivery time will be calculated at checkout, but in general, the following shipping times apply:
 
Standard Delivery
Main centres:  1-3 business days
Regional areas: 3-4 business days
Remote areas: 3-5 business days
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Product details

Condition
New
Location
South Africa
Product code
CL-O023-GROSGM-A
Bob Shop ID
618244569

All our Products are Brand New & Sealed with Manufacturer Warranty

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Please check what you received is correct before opening!!

 

Thermaltake TG-30 Thermal Heat Sink Compound Paste CL-O023-GROSGM-A

TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.

High Thermal Conductivity

The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user's primary needs.

Easy to Apply

Thermaltake's specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.

All-In-One Application Kit

This thermal compound application kit includes a set of easily-applied tools for immediate use.

Sustainability and Safety

The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and your system.

Technical Specification

Thermal Conductivity: 4.5 W/m-k
Density: 2.55 g/cm3
Viscosity: 76 Pa-s
Thermal Impedance: 0.185°C -in2/W
Colour: Grey
Weight: 4g

 

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