| Main centres: | 1-3 business days |
| Regional areas: | 3-4 business days |
| Remote areas: | 3-5 business days |
Problem:
Electronic components can suffer from heat buildup due to ineffective or degraded thermal interface materials.
Solution:
This thermal putty enhances heat transfer between chips and cooling systems, improving thermal efficiency and stability.
Features:
High thermal conductivity compound
Flexible application material
Replaces traditional thermal pads
Suitable for GPU and electronic components
Benefits:
Improved heat dissipation
Reduced thermal throttling
Better temperature stability
More efficient cooling performance
Compatibility:
Compatibility not fully confirmed verify before installation
Installation Note:
Moderate installation required. Clean surface thoroughly before applying thermal material.
