UPSIREN UTP-8 14.8w/mk Thermal Putty, 20g, High-performance Cooling for GPU, VRM, Laptop, IC, VRAM 

This is a high-performance thermal putty from the brand UPSIREN, designed as a thermal interface material (TIM) for cooling electronic components. It serves as a replacement for traditional thermal pads, offering superior gap-filling and heat transfer for applications like VGA cards, GPUs, IC processors, VRMs, RAM, laptops, and consoles

Specification

• Weight: 20 grams
• Thermal Conductivity: 14.8 W/m·K, enabling efficient heat dissipation to prevent overheating.
• Consistency: A tacky, non-drying putty that's fully cured, low-viscosity for easy dispensing or screen-printing, and provides good compression without pump-out (unlike some pastes).
• Compliance: RoHS-compliant and halogen-free, making it safe for environments that restrict hazardous substances
• Advantages Over Pads: Fills microscopic gaps better for improved contact and thermal performance; cost-effective for rework or repairs.
• Limitations: Not suitable as a silicone grease substitute for CPUs (use dedicated thermal paste instead).
  
  
  
  

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DISCLAIMER:

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