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Heat Sink, For Board Level Power Semiconductor, 11 °C/W, TO-220, 34.9 mm, 38.1mm, 12.7 mmProduct InformationThermal Resistance: 11°C/WPackages Cooled: TO-220External Width - Metric: 34.9mmExternal Height - Metric: 38.1mmExternal Length - Metric: 12.7mmHeat Sink Material: AluminiumExternal Width - Imperial: 1.37"External Height - Imperial: 1.5"External Length - Imperial: 0.5"Product OverviewThe 637-15ABEP is a 38.1 x 34.9 x 12.7mm high-efficiency Heat Sink made ofaluminium with black anodized finish. This board level heat sink featureswave-solderable pins on 1-inch centre for vertical mounting on printed circuitboards. Use this heat sink where weight and board space occupied must beminimized.ApplicationsIndustrial